JPH049396B2 - - Google Patents

Info

Publication number
JPH049396B2
JPH049396B2 JP59056781A JP5678184A JPH049396B2 JP H049396 B2 JPH049396 B2 JP H049396B2 JP 59056781 A JP59056781 A JP 59056781A JP 5678184 A JP5678184 A JP 5678184A JP H049396 B2 JPH049396 B2 JP H049396B2
Authority
JP
Japan
Prior art keywords
resin
circuit board
core material
nonwoven fabric
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59056781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60200590A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5678184A priority Critical patent/JPS60200590A/ja
Publication of JPS60200590A publication Critical patent/JPS60200590A/ja
Publication of JPH049396B2 publication Critical patent/JPH049396B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
JP5678184A 1984-03-24 1984-03-24 印刷回路基板及びその製法 Granted JPS60200590A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5678184A JPS60200590A (ja) 1984-03-24 1984-03-24 印刷回路基板及びその製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5678184A JPS60200590A (ja) 1984-03-24 1984-03-24 印刷回路基板及びその製法

Publications (2)

Publication Number Publication Date
JPS60200590A JPS60200590A (ja) 1985-10-11
JPH049396B2 true JPH049396B2 (en]) 1992-02-20

Family

ID=13036969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5678184A Granted JPS60200590A (ja) 1984-03-24 1984-03-24 印刷回路基板及びその製法

Country Status (1)

Country Link
JP (1) JPS60200590A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299814A (ja) * 2001-04-03 2002-10-11 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2009044111A (ja) * 2007-08-10 2009-02-26 Akitomo Tejima プリント配線板の製造方法
US8044499B2 (en) * 2008-06-10 2011-10-25 Semiconductor Energy Laboratory Co., Ltd. Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof
CN110089202A (zh) * 2016-12-28 2019-08-02 株式会社藤仓 布线基板和布线基板的制造方法
JP2019134123A (ja) * 2018-02-02 2019-08-08 株式会社フジクラ 配線基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453264A (en) * 1977-10-04 1979-04-26 Suwa Seikosha Kk Bilateral printed board

Also Published As

Publication number Publication date
JPS60200590A (ja) 1985-10-11

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